Featur
Featur & Benefits
- Ultra-low capacitance (0.05pF t.) ideal for high speed data applications
- Provid D protection with fast rponse time (<1ns) allowing equipment to p IEC 61000-4-2 level 4 tt
- Single-line, bi-directional device for placement flexibility
- Low profile 0402/1005 dign for board space savings
- Low leakage current (<0.1nA t.) reduc power con
Environmental Specifications:
- Load Humidity: 12VDC per EIA/IS-772 Para. 4.4.2, +85°C, 85% RH for 1000hours
- Thermal Shock: EIA/IS-722 Para 4.6, Air to Air -55°C to +125°C, 5 cycl
- Moisture Ristance Tt: MIL-STD-202G Method 106G, 10 cycl
- Mechanical Shock: EIA/IS-722 Para. 4.9
- Vibration: EIA/IS-722 Para. 4.10
- Ristance to Solvent: EIA/ IS -722 Para. 4.11
- Operating & Storage Temperature Range: -55°C to +125°C
Soldering Recommendations
- Compatible with lead and lead-free solder reflow procs
- Peak reflow temperatur and durations:
- IR Reflow = 260°C max for 10 sec. max.
- Wave Solder = 260°C max
