應(yīng)用領(lǐng)域：RoHS、鹵素指令檢測(cè)
鍍層厚度測(cè)試
合金分析（銅合金不銹鋼等）
產(chǎn)品特點(diǎn)：
Product Features
1. 采用美國(guó)原裝電致冷Si-PIN探測(cè)器，分辨率高，探測(cè)范圍寬,涵蓋RoHS、鹵素、鍍層、合金(含貴金屬)及各種常規(guī)材料分析的基本要求。
Using the original refrigeration high-performance Si-PIN detector, high resolution, wide detection range and covers the RoHS,halogen, plating, alloy (including precious metals) and basic requirements of various kinds of conventional material ysis.
2. 配置國(guó)際的DPP數(shù)字多道信號(hào)集成處理器，比普通模擬多道信號(hào)處理器性能更佳，尤其在高計(jì)數(shù)率時(shí)有更好的分辨力(如Hg和Cl等)，80MHz的數(shù)輸速度使分析時(shí)間更短，測(cè)量重復(fù)性和長(zhǎng)期穩(wěn)定性更好。
Configuring the international most advanced DPP with dial integrated multichannel signal processor. Multi-channel signal processor performance is better than the general simulation, especially in the high count rate has better resolution (such as Hg and Cl). The speed of the data tranission up to 80 MHZ make the ysis time shorter, repeatability better and long-term stability.
3. 內(nèi)置高清攝像系統(tǒng)，清晰觀察樣品，準(zhǔn)確定位樣品測(cè)試區(qū)域。
Built-in high-definition camera system, observe the sample clearly and locate sample test area accurately.
4. 配套新的FP測(cè)量軟件，集成多種譜圖處理算法和基體校正算法，降低儀器測(cè)量中的各種干擾譜峰，使低含量和痕量元素的檢測(cè)結(jié)果更加準(zhǔn)確，更加接近真值水平。
Configuring the latest FP measuring software, integrate variety of spectrogram processing algorithm and matrix correction algorithm, can reduce the various interference spectrum peak in the instrument measuring effectively, to make low content and trace elements test results more accurate, more close to the true value
技術(shù)參數(shù):
Specifications
1. 分析范圍:硫（S）－鈾（U）
Measurable elements：S-U
2. 含量范圍:2ppm-99.99％
Element content: 2ppm-99.99％
3. 測(cè)量時(shí)間:50-300秒(可調(diào))
Measurement time 50-300s（adjustable）
4. 能量分辨率:149&plun;5eV
Resolution: 149&plun;5eV
5. 高壓電源功率:50W
High voltage power supply power：50W
6. 樣品腔尺寸: 610mm×320mm×100mm
Sample chamber size : 610mm×320mm×100mm
