2D非接觸式測(cè)厚機(jī)YL-881

Laser Vision Measurement品管量測(cè)設(shè)備

產(chǎn)品特性（FEATUR）

◆使用Window’s視窗介面，中/英文化書面，操作簡(jiǎn)單。

◆手動(dòng)量測(cè)錫膏厚度

◆手動(dòng)測(cè)量長(zhǎng)、寬及兩錫膏間之距離（間距）

◆測(cè)量值可記錄存檔及列印

◆提供厚度分布統(tǒng)計(jì)圖表及X_Bar_R管制表

◆自動(dòng)計(jì)算制程能力指標(biāo)CP、CPK、

◆可依不同生產(chǎn)線分別作記錄

◆可依基板厚度調(diào)整焦距

◆可做定時(shí)呼叫取樣

◆All operations are easy and using Windows interface in Chine/English version.

◆Survey thickns of tin solder by auto matica lly or manually.

◆Survey the length and width manually,and the gap of tin solder.

◆Calculate the measure of area, the measure of cross-seion and the measure of volumn automatically.

◆All surveyed valu can be recorded to a file and be printed to a report.

◆Provide the diagrams of thickns distribution and control diagrams of X_BAR_R.

◆Calculate man faure ability degree automatically(CP, CPK, )

◆It can have proprietary record according to every different produion ling.

◆It can adjust focus point in different thickns of PC boards.

◆It can be called to sample periodically.

適用（APPLECATION）

◆各式厚度量測(cè)數(shù)值取得統(tǒng)計(jì)分析

◆錫膏印刷機(jī)制程品管檢查

◆錫膏印刷厚度良性測(cè)量

◆錫膏印刷成型，尺寸量測(cè)檢查

◆提供其他物品測(cè)厚，測(cè)長(zhǎng)，量測(cè)檢查

◆Get the rults of statistics and ysis about all surveyed valu in every thickns degree.

◆Inspe the quality of solder printing procs.

◆Survey the thickns benignancy of tin solder

◆Measure the dimension of tin solder

◆Provide thickns and dimension measurement funion for other objes

功能（FUNION）

◆量測(cè)印刷錫膏厚度、長(zhǎng)度、高度、間距。

◆提供厚度分布數(shù)值參考。

◆提供各種統(tǒng)計(jì)分析圖表

  X管制圖、R管制圖、厚度列表

  X平均值管制圖單點(diǎn)列表

◆Surveying the thickns of printing tin solder, length ,height and interval.

◆Provide the referenc of thickns distribution valu.

◆Provide the ysis of different measure of cross-seion.

◆Calculate the measure of area and volumn automatically in obje which to be surveyed.

◆Provide all diagrams of statistics and ysis.

  Provide X control Diagram, R Control Diagram

  and Thickns List Diagram. Provide X Average

  Control Diagram, Single Point List Diagram.