一、HY-3832型BGA返修臺特點(diǎn)
1、該機(jī)采用臺灣高清觸摸屏人機(jī)界面,PLC控制,可存儲多組用戶溫度曲線數(shù)據(jù).開機(jī)密碼保護(hù)和修改功能,工作時(shí)溫度以曲線的方式將數(shù)據(jù)反應(yīng)到觸摸屏內(nèi)顯示,具有瞬間曲線分析功能.
2、采用線性滑座使X、Y、Z三軸皆可做精細(xì)微調(diào)或快速定位動作,具有較高的定位和快捷的操作性.
3、采用三溫區(qū)獨(dú)立加熱,上下溫區(qū)熱風(fēng)加熱,底部溫區(qū)紅外加熱,溫度控制在±2度,上部溫區(qū)可視需要自由移動,第二溫區(qū)可上下調(diào)節(jié),上下部發(fā)熱器可同時(shí)設(shè)置多段溫度控制. IR預(yù)熱區(qū)可依實(shí)際要求調(diào)整輸出功率.
4、熱風(fēng)嘴可360°旋轉(zhuǎn).底部紅外發(fā)熱器可使PCB板受熱均勻.
5、選用高K型熱電偶閉環(huán)控制,外置測溫接口實(shí)現(xiàn)對溫度的精密檢測.PCB板定位采用V字形槽,靈活方便的可移動式夾具對PCB板起到保護(hù)作用,防止PCB邊緣器件損傷及PCB變形,并能適應(yīng)各種BGA封裝尺寸的返修.
6、采用大功率橫流風(fēng)機(jī)迅速對PCB板進(jìn)行冷卻,提高工作效率.同時(shí)內(nèi)置真空泵,外置真空吸筆,以方便快捷取拿BGA芯片.
7、焊接工作完畢具有程序結(jié)束報(bào)警提示功能。
8、本機(jī)經(jīng)過CE,異常事故自動斷電保護(hù)裝置.在溫度失控情況下,電路能自動斷電,擁有雙重超溫保護(hù)功能.
二、技術(shù)參數(shù):
1 | 總功率 | 4800W |
2 | 上部加熱功率 | 800W |
3 | 下部加熱功率 | 第二溫區(qū)1200W,第三(IR)溫區(qū)2700W |
4 | 電源 | AC220V±10%50/60Hz |
5 | 外形尺寸 | 635×600×560mm |
6 | 定位方式 | V字形卡槽,PCB支架可X、Y任意方向調(diào)整并配置夾具 |
7 | 溫度控制 | K型熱電偶(K Sensor)閉環(huán)控制,獨(dú)立控溫,可達(dá)±3度; |
8 | PCB尺寸 | Max 380×320mm Min 10×10 mm |
9 | 電氣選材 | 高靈敏溫度控制模塊+臺達(dá)PLC+臺灣觸摸屏 |
10 | 機(jī)器重量 | 40kg |
Features:
一、Adopted with Linear slider, so all the three axles (X, Y, and Z) can do fine tuning and quick orientation with perfect positioning accuracy and speedily maneuverability
二、Equipped with touch panel interface and PLC controlling to ensure it work stably and reliably. And it can storage multiple temperature profiling data of users. With password protection and modification function while power on. The temperature profiles will be displayed on the touch screen
三、Three temperature zones to heat up independently, hot air heat up between up and down zones, IR heat in the bottom, temperature precise control is in±3℃.The upper temperature zone can be moved freely according to needs, the second zone can be adjusted up and down. The top and bottom heaters can be set several segments control at the same time. IR heating zone can be adjusted output power in the light of operation requirements.
四、The hot air nozzle can be rotated in 360 degree, the IR heater in the bottom can heat up the PCB board uniformly.
五、High accuracy K-type thermocouple closed-loop controlling. It can test temperature accurately through external temperature measurement interface, PCB board positioned by closed V-shape slot. The flexible and convenient universal jigs can prevent any damage or PCB deformation as well as it is suitable for all size of BGA package.
六、Large power fan to cool down the PCB quickly. The built-in vacuum pump and external vacuum nozzle is able to take BGA chips out easily.
Having alarm prompt function after welding is done, specially added early warning function for
七、convenient operation.
八、It has Passed CE certificate. It is equipped with emergency stop switch and protection equipment to power off automatically when abnormal accident happened. Under this situation that temperature is out of control, circuit can automatically cut off the power with double over temperature protection function.
Technology Parameters
Total Power | 4800W |
Upper Heating Power | 800W |
Lower Heating Power | Second zone:1200W, Third zone: IR 2700W |
Power Supply | AC 220V±10% 50/60HZ |
Overall Dimension | L605*W600*H520mm |
Locating Mode | V-shape card slot, PCB holder can be adjustable by X and Y axes with universal jigs. |
Temperature Controlling | K-type thermocouple closed loop control, independent temperature control, precision up to ±3 degree |
PCB Size | Max 380*320mm, Min 10*10mm |
Electrical Material | High sensitive temperature control module,Touch Screen made-in Taiwan |
Weight of machine | 30KG |